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SetnaSetna
SetnaSetna
  • Home
  • About Us
    • Mission and History
    • Meet Our Team
  • Flip Chip Bonders
    • ACCµRA™ M
    • ACCµRA™ OPTO
    • ACCµRA™100
    • ACCµRA™ Plus
    • FC150 PLATINUM
    • FC300
    • LDP150
  • Atmospheric Plasma
    • ONTOS CLEAN
    • Atmospheric Plasma – OntosIS (OEM)
  • Delta Printing System
  • Other Products
    • MagVision Kerr Imaging System
    • AST IR Imaging Microscopes
  • Events & Technical Papers
    • Conferences / Exhibitions
    • C2W Hybrid Bonding Consortium
    • TP: Die Bonders
    • TP: Atmospheric Plasma
  • Contact Us

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Posts

  • SEMICON Japan 2025, Dec. 17-19, Tokyo, Japan
  • SEMICON Europe 2025, Nov. 18-21, Munich, Germany
  • Ontos Equipment Systems joined the C2W Hybrid Bonding Consortium led by A*Star’s Institute of Microelectronics
  • Comparison of Ontos7 Treated and Un-Treated Cu Plating Base
  • Ontos 7 Treated SAC bumps on Si Chip

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Information about SET Bonders:

SET – Smart Equipment Technology, is the leading supplier of high accuracy Die-to-Die and Die-to-Wafer bonders.

Visit set-sas.fr.

Information about OES Plasma:

ONTOS Equipment Systems, a sister company founded by SETNA, is a manufacturer of innovative devices for surface activation using room-temperature plasma.

Visit ontosplasma.com.

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