Full Range of Highly Accurate Die Bonders and Flip Chip Bonders developped and manufactured by SET Corporation
The ACCµRA™ M is a manual flip-chip / die bonder that allows ± 3 μm accuracy. This equipment permits to align manually the components with a high level of precision. The motorized arm controls precisely the bonding force. Combining and synchronizing the arm with the temperature controller, it guarantees a perfect quality and high repeatability of your process. The ACCµRA™ M is more than a pick-and-place system. It offers thermocompression and reflow capabilities. It is the perfect equipment for universities and R&D institutes.
The ACCµRA™ OPTO is a flip-chip / Die bonder that allows ± 0.5 μm accuracy. It is dedicated to low force and reflow processes. Motorized axes guarantee a high repeatability of your processes. The ACCµRA™ OPTO combines high precision, flexibility and accessibility. It is the perfect equipment for optoelectronics and silicon photonics applications.
The ACCµRA™100 is a semi-automatic flip-chip / Die bonder that guarantees ±0.5 µm placement accuracy. Its flexibility makes it ideal for developing a wide range of applications. ACCµRA™100 combines high precision, accessibility and cost-effectiveness. It is the perfect equipment for universities and R&D institutes.
ACCµRA™ Plus: Production Flip Chip / Die Bonder for Optoelectronic and Silicon photonics applications
The SET ACCµRA™ Plus is a flip-chip / Die bonder designed for ± 0.5 μm accuracy in full automatic mode. It is suitable for reflow and thermocompression processes. ACCµRA™ Plus combines high precision, flexibility and short cycle time.
With ± 0.5 µm placement accuracy and ± 1 µm post-bond accuracy, the SET FC150 Flip Chip / Die Bonder offers the latest evolutions in bonding techniques. With configurations ranging from manual to full automation, the FC150 provides development and production capabilities on a single upgradeable cost-effective platform. The high degree of flexibility offered on the FC150 makes it the machine of choice for advanced research with the ability to move directly into pilot production.
The FC300 High Precision Flip Chip / Die Bonder is a high accuracy and high force system for chip-to-chip and chip-to-wafer bonding, on wafers up to 300 mm. The tool features automated handling of chips and substrates up to 100 mm from waffle packs. It features also Nanoimprinting Lithography (NIL) capabilities.
The LDP150 is an Electrical Press especially designed for Finalizing the bonding of large light or radiation detectors (50 ~ 150 mm). It uses compression process at room temperature (thermo-compression option available). A predefined gap can be achieved between two components previously pre-bonded using a high accuracy device bonder such as the SET FC150 or the SET FC300.