Ontos Equipment Systems joined the C2W Hybrid Bonding Consortium led by A*Star’s Institute of Microelectronics
MEMBERS OF THE CHIP-TO-WAFER HYBRID BONDING CONSORTIUM:
- A*STAR’s Institute of Microelectronics
- ASM Pacific (Hong Kong) Ltd
- Capcon Singapore Pte Ltd
- HD MicroSystems, Ltd
- ONTOS Equipment Systems, Corporation
- Panasonic Smart Factory Solutions Co., Ltd.
- SEKISUI CHEMICAL CO., LTD.
- Toray Industries, Inc.
- Yamaha Robotics Holdings Co., Ltd.