Ontos Equipment Systems joined the C2W Hybrid Bonding Consortium led by A*Star’s Institute of Microelectronics

See the IME press release

MEMBERS OF THE CHIP-TO-WAFER HYBRID BONDING CONSORTIUM:

• A*STAR’s Institute of Microelectronics
• ASM Pacific (Hong Kong) Ltd
• Capcon Singapore Pte Ltd
• HD MicroSystems, Ltd
• ONTOS Equipment Systems, Corporation
• Panasonic Smart Factory Solutions Co., Ltd.
• SEKISUI CHEMICAL CO., LTD.
• Toray Industries, Inc.
• Yamaha Robotics Holdings Co., Ltd.