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    • FC150 PLATINUM
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  • Atmospheric Plasma
    • ONTOS CLEAN
    • Atmospheric Plasma – OntosIS (OEM)
  • Delta Printing System
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    • MagVision Kerr Imaging System
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SetnaSetna
SetnaSetna
  • Home
  • About Us
    • Mission and History
    • Meet Our Team
  • Flip Chip Bonders
    • ACCµRA™ M
    • ACCµRA™ OPTO
    • ACCµRA™100
    • ACCµRA™ Plus
    • FC150 PLATINUM
    • FC300
    • LDP150
  • Atmospheric Plasma
    • ONTOS CLEAN
    • Atmospheric Plasma – OntosIS (OEM)
  • Delta Printing System
  • Other Products
    • MagVision Kerr Imaging System
    • AST IR Imaging Microscopes
  • Events & Technical Papers
    • Conferences / Exhibitions
    • C2W Hybrid Bonding Consortium
    • TP: Die Bonders
    • TP: Atmospheric Plasma
  • Contact Us
  • ACCµRA Family
    Cost-effective Die Bonders.
    Accuracy and Versatility.
    Education and R&D oriented.
    LEARN MORE
  • ONTOS CLEAN
    Cost-effective Atmospheric Plasma System, requiring no chamber.
    LEARN MORE
  • ONTOS Plasma
    Enables Room Temperature
    Bond Process for 3D Stacking
    LEARN MORE
  • ACCµRA Plus
    Die / Flip Chip Bonder Dedicated to Production for Optoelectronics and Silicon Photonics Applications
    LEARN MORE
  • FC150 PLATINUM
    Engineered to maximize accuracy and versatility.
    LEARN MORE
  • FC300
    High Force Flip Chip Bonder

    0.5µm Post Bond Accuracy
    LEARN MORE
     
  • ONTOS Equipment Systems joined the C2W Hybrid Bonding Consortium led by A*Star’s Institute of Microelectronics.
    LEARN MORE
     

Welcome to Setna

High-accuracy Bonding and Plasma Surface Preparation

SETNA is a Manufacturing and Marketing, Sales and Service Organization. It is centered on our experience and know-how in high-accuracy bonding and the equipment, materials, competencies surrounding it including Surface Preparation with Atmospheric Plasma.

SET Bonders have been the world-standard for applications in which micron precision post bond accuracy is required. For more than twenty years the FC150 Series has been the tool of choice. The FC300 series bonders provide the highest force and bonding accuracy available in the industry. The ACCµRA series provide accurate and versatile die bonders for education and R&D.

ONTOS is the atmospheric plasma system, designed by our sister company OES (ONTOS Equipment systems), for and dedicated exclusively to the semiconductor manufacturing and packaging industry. Our patented (and patent pending) equipment and processes provide a unique advantage to our customers. It enables low-cost, high yield, high-speed, chip-to-chip interconnect bonds at room temperature with minimal force. ONTOS Atmospheric Plasma also improves surface activation for direct bonding, aqueous wetting, contamination removal, adhesive bonding, and more.

Latest News:

EMPC2025 | September 16-18 | Grenoble | France

High-accuracy Bonding and Plasma Surface Preparation

SEMICON West | October 7-9, 2025 | Phoenix AZ, USA

Recent Videos:

ACCµRA 100:

OES Direct Bonding:

Contact Us

Please send us a message and we'll get back to you.

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Contact Us:

  • Setna, LLC
  • 343 Meadow Fox Ln, Chester, NH 03036
  • +1 (603) 548-7870
  • sales@set-na.com

Technical Papers Quick Links:

  • Atmospheric Plasma
  • Die Bonders

Information about SET Bonders:

SET – Smart Equipment Technology, is the leading supplier of high accuracy Die-to-Die and Die-to-Wafer bonders.

Visit set-sas.fr.

Information about OES Plasma:

ONTOS Equipment Systems, a sister company founded by SETNA, is a manufacturer of innovative devices for surface activation using room-temperature plasma.

Visit ontosplasma.com.

© 2025 — Setna, LLC

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