IMAPS Device Packaging | March 5-7, 2025 | Phoenix, Arizona, USA
21st International Conference and Exhibition on Device Packaging Venue: Sheraton at Wild Horse Pass, Phoenix, Arizona, USA. Exhibition hours: 10:00am to 6:00pm on Tuesday 19th. 10:00am to 4:00pm on Wednesday 20th. We shall be pleased to welcome you to the SETNA Booth #213, to discuss accurate Die/Flip Chip bonding and Atmospheric Plasma Surface Preparation for bonding and other applications. Surface Preparation...
EMPC2025 | September 16-18 | Grenoble | France
Meet our sister company ONTOS Equipment Systems on Booth #19 Venue: World Trade Center, Grenoble, France. Exhibition hours: 9:00 am to 5:45 pm on Tuesday, September 16. 9:00 am to 5:45 pm on Wednesday, September 17. 9:00 am to 5:15 pm on Thursday, September 18. Surface Preparation using Atmospheric Plasma Introducing the New System ONTOS CLEAN We shall be pleased to discuss the advantages of our Atmospheric Plasma (ONTOS) for...
SEMICON West | October 7-9, 2025 | Phoenix AZ, USA
SEMICON-West – Meet us on SET Corporation booth #557 Venue: Convention Center, Phoenix, Arizona, USA. Exhibition hours: 10:00am to 5:00pm on Tuesday, October 7. 10:00am to 5:00pm on Wednesday, October 8. 10:00am to 4:00pm on Thursday, October 9. High Accuracy Flip-Chip Bonders and Surface Preparation for Bonding using Atmospheric Plasma High Accuracy Die / Flip Chip Bonding SETNA distribute the SET Corporation...
SEMICON Europe 2025 | Nov. 18-21 | Munich, Germany
SEMICON-Europa Meet our sister company ONTOS on Booth C2-433 to discuss the Atmospheric Plasma ONTOS CLEAN and its OEM Version ONTOS IS Exhibition hours: 9:00am to 6:00pm on Tuesday, November 18. 9:00am to 6:00pm on Wednesday, November 19. 9:00am to 6:00pm on Thursday, November 20. 9:00am to 4:00pm on Friday, November 21. Surface Preparation with Ontos Atmospheric Plasma We shall be pleased to discuss the Advantages of our...