OFC 2019, May 5-7, San Diego, CA, USA

    The Optical Networking and Communication Conference & Exhibition OFC is the largest global conference and exhibition for optical communications and networking professionals. Venue: San Diego Convention Center, San Diego, California, USA Exhibition hours: Tuesday, May 5         >> 10:00 am – 5:00 pm Wednesday, May 6  >> 10:00 am – 5:00 pm Thursday, May 7       >> 10:00 am – 4:00 pm SETNA (Booth #601): High...

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IMAPS Device Packaging 2019, March 5-7, AZ, USA

15th International Conference and Exhibition on Device Packaging Venue: WekoPa Resort and Casino, Fountain Hills, Arizona USA. Exhibition hours: 10:00am to 6:30pm on Tuesday 5th. 10:00am to 4:00pm on Wednesday 6th. SETNA (booth #41): Surface Preparation using Atmospheric Plasma and High Accuracy Flip-Chip Bonders.     Surface Preparation using Atmospheric Plasma We shall be pleased to discuss the Advantages of our Atmospheric Plasma...

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69th ECTC – May 28-31, 2019 – Las Vegas, NV, USA

  The Electronic Components and Technology Conference (ECTC) is sponsored by the Components, Packaging and Manufacturing Technology (CPMT) Society of the IEEE. Venue: The Cosmopolitan of Las Vegas. Exhibition hours: Wednesday, May 29 >> 9:00 am – noon & 1:30 – 6:30 pm Thursday, May 30      >> 9:00 am – noon & 1:30 – 4:00 pm We shall be pleased to welcome you to the SET/SETNA Booth #423 to discuss...

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SEMICON West – July 9-11, 2019, Moscone Center, San Francisco CA, USA

SEMICON-West – Meet us on booth #6365 (North Hall) Venue: Moscone Center, San Francisco, CA. Exhibition hours: 10:00am to 5:00pm on Tuesday, July 9. 10:00am to 5:00pm on Wednesday, July 10. 10:00am to 4:00pm on Thursday, July 11. SET/SETNA (Booth #6365): High Accuracy Flip-Chip Bonders and Surface Preparation using Atmospheric Plasma We shall be pleased to welcome you on the SET Booth to discuss accurate Die/Flip Chip bonding...

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IWLPC – October 22-24, 2018 – San Jose, CA, USA

IWLPC – International Wafer-Level Packaging Conference and Tabletop Exhibition Venue: DoubleTree by Hilton, San Jose, California, USA. Exhibition hours: Tuesday 22 — 10:00am to 5:00pm (Reception: 5:30pm to 7:00pm). Wednesday 23 — 9:30am to 3:30pm.   We shall be pleased to welcome you to the SETNA/SET Booth #11 to discuss accurate Die/Flip Chip bonding and surface preparation for bonding and other applications.      ...

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SEMICON Europe – Nov. 12-15, 2019 – Munich, Germany

  SEMICON-Europa – Meet us on Booth B1-657 Venue:Messe München, Munich, Germany. Exhibition hours: 9:00am to 6:00pm on Tuesday, November 12. 9:00am to 6:00pm on Wednesday, November 13. 9:00am to 6:00pm on Thursday, November 14. 9:00am to 4:00pm on Friday, November 15.     Surface Preparation with Ontos Atmospheric Plasma We shall be pleased to discuss the Advantages of our Clean Atmospheric Plasma (Ontos) for Surface...

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