IMAPS – MiNaPAD | June 19-20, 2024 | Grenoble – France

Meet our sister company ONTOS Equipment Systems on Booth #5 Venue:  World Trade Center, Grenoble, France. Exhibition hours: 9:00am to 6:30pm on Thursday, June 19. 9:00am to 4:00pm on Friday, June 20. Wednesday 19, at 11:45am, SESSION C: Interconnections (Auditorium) Presentation by Dan Pascual: “Alternative approach to Die-to-Wafer bonding utilizing atmospheric plasma cleaning”     Surface Preparation using...

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SEMICON West | July 9-11, 2024 | San Francisco CA, USA

SEMICON-West – Meet us on SET Corporation booth #460 (South Hall) Venue: Moscone Center, San Francisco, CA. Exhibition hours: 10:00am to 5:00pm on Tuesday, July 9. 10:00am to 5:00pm on Wednesday, July 10. 10:00am to 4:00pm on Thursday, July 11. High Accuracy Flip-Chip Bonders and Surface Preparation for Bonding using Atmospheric Plasma     High Accuracy Die / Flip Chip Bonding SETNA distribute the SET Corporation...

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SEMICON Europe 2024, Nov. 12-15,Munich, Germany

SEMICON-Europa Meet us on Booth C2-433 to see the New Atmospheric Plasma ONTOS CLEAN Exhibition hours: 9:00am to 6:00pm on Tuesday, November 12. 9:00am to 6:00pm on Wednesday, November 13. 9:00am to 6:00pm on Thursday, November 14. 9:00am to 4:00pm on Friday, November 15.   Surface Preparation with Ontos Atmospheric Plasma We shall be pleased to discuss the Advantages of our New Atmospheric Plasma (Ontos CLEAN) for Surface...

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