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  • Home
  • About Us
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  • Flip Chip Bonders
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    • ACCµRA™ OPTO
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  • Delta Printing System
  • Other Products
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    • TP: Die Bonders
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  • Contact Us

EMPC2025 | September 16-18 | Grenoble | France

Home » EMPC2025 | September 16-18 | Grenoble | France

EMPC2025 | September 16-18 | Grenoble | France

May 14, 2025 Posted by Setna Latest News

Meet our sister company ONTOS Equipment Systems on Booth #19

Venue:  World Trade Center, Grenoble, France.

Exhibition hours:

  • 9:00 am to 5:45 pm on Tuesday, September 16.
  • 9:00 am to 5:45 pm on Wednesday, September 17.
  • 9:00 am to 5:15 pm on Thursday, September 18.

Thursday,  Sept 18, 2025 – Session 8B: Assembly and Manufacturing (room Kilimandjaro)

11:55-12:20: Do not miss the presentation from Daniel Pascual: “Atmospheric Plasma Cleaning of Copper Oxide and Tin Oxide for Flux-Free Interconnect Bonding”

Surface Preparation using Atmospheric Plasma

Introducing the New System ONTOS CLEAN

We shall be pleased to discuss the advantages of our Atmospheric Plasma (ONTOS) for Surface Preparation. It is applicable to numerous process steps for Semiconductor Manufacturing or Assembly, and it can be integrated into production machines.

Applications include:

  • photoresist de-scum & activation,
  • preparation for Plating,
  • photomask cleaning,
  • bonding (de-oxidation, protection against re-oxidation),
  • preparation for Capillary underfill,
  • surface activation for die attach adhesion, etc.

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About Setna

SETNA is a Manufacturing and Marketing, Sales and Service Organization. It is centered on our experience and know-how in high-accuracy bonding and the equipment, materials, competencies surrounding it including Surface Preparation with Atmospheric Plasma. SET Bonders have been the world-standard for applications in which micron precision post bond accuracy is required.

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    Technical Papers Quick Links:

    • Atmospheric Plasma
    • Die Bonders

    Information about SET Bonders:

    SET – Smart Equipment Technology, is the leading supplier of high accuracy Die-to-Die and Die-to-Wafer bonders.

    Visit set-sas.fr.

    Information about OES Plasma:

    ONTOS Equipment Systems, a sister company founded by SETNA, is a manufacturer of innovative devices for surface activation using room-temperature plasma.

    Visit ontosplasma.com.

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