• Home
  • About Us
    • Mission and History
    • Meet Our Team
  • Flip Chip Bonders
    • ACCµRA™ M
    • ACCµRA™ OPTO
    • ACCµRA™100
    • ACCµRA™ Plus
    • FC150 PLATINUM
    • FC300
    • LDP150
  • Atmospheric Plasma
    • ONTOS CLEAN
    • Atmospheric Plasma – OntosIS (OEM)
  • Delta Printing System
  • Other Products
    • MagVision Kerr Imaging System
    • AST IR Imaging Microscopes
  • Events & Technical Papers
    • Conferences / Exhibitions
    • C2W Hybrid Bonding Consortium
    • TP: Die Bonders
    • TP: Atmospheric Plasma
  • Contact Us

Call us today! +1 (603) 548-7870

Find our Location
[email protected]
Login

Login
SetnaSetna
SetnaSetna
  • Home
  • About Us
    • Mission and History
    • Meet Our Team
  • Flip Chip Bonders
    • ACCµRA™ M
    • ACCµRA™ OPTO
    • ACCµRA™100
    • ACCµRA™ Plus
    • FC150 PLATINUM
    • FC300
    • LDP150
  • Atmospheric Plasma
    • ONTOS CLEAN
    • Atmospheric Plasma – OntosIS (OEM)
  • Delta Printing System
  • Other Products
    • MagVision Kerr Imaging System
    • AST IR Imaging Microscopes
  • Events & Technical Papers
    • Conferences / Exhibitions
    • C2W Hybrid Bonding Consortium
    • TP: Die Bonders
    • TP: Atmospheric Plasma
  • Contact Us

Semicon Korea 2026 | February 11-13 | Seoul | Korea (South)

Home » Semicon Korea 2026 | February 11-13 | Seoul | Korea (South)

Semicon Korea 2026 | February 11-13 | Seoul | Korea (South)

February 11, 2026 Posted by Setna Latest News

Meet our sister company ONTOS Equipment Systems, on the Woowon Technology Booth, A354

Venue:  COEX, Seoul, Korea.

Exhibition hours:

  • February 11, 2026 | 10:00-17:00 (Last entry 16:30)
  • February 12, 2026 | 10:00-17:00 (Last entry 16:30)
  • February 13, 2026 | 10:00-16:00 (Last entry 15:30)
ONTOS_CLEAN

Surface Preparation using Atmospheric Plasma

Introducing the New System ONTOS CLEAN

We shall be pleased to discuss the advantages of our Atmospheric Plasma (ONTOS) for Surface Preparation. It is applicable to numerous process steps for Semiconductor Manufacturing or Assembly, and it can be integrated into production machines.

Applications include:

  • photoresist de-scum & activation,
  • preparation for Plating,
  • photomask cleaning,
  • bonding (de-oxidation, protection against re-oxidation),
  • preparation for Capillary underfill,
  • surface activation for die attach adhesion, etc.
Share
0

About Setna

SETNA is a Manufacturing and Marketing, Sales and Service Organization. It is centered on our experience and know-how in high-accuracy bonding and the equipment, materials, competencies surrounding it including Surface Preparation with Atmospheric Plasma.

You also might be interested in

Copper Plating

Comparison of Ontos7 Treated and Un-Treated Cu Plating Base

Jun 8, 2014

Movie showing the significant improvement of the wetting after Atmospheric[...]

Ontos 7 Treated SAC bumps on Si Chip

Ontos 7 Treated SAC bumps on Si Chip

Jun 8, 2014

This video is showing the Wetting Improvement provided by the[...]

Device Packaging 2026 | March 2-5 | Phoenix, AZ | USA

Device Packaging 2026 | March 2-5 | Phoenix, AZ | USA

Feb 11, 2026

Meet our sister company ONTOS Equipment Systems, Booth 703 Venue:  The[...]

Contact Us (SETNA) :


    Contact Us:

    • Setna, LLC
    • 343 Meadow Fox Ln, Chester, NH 03036
    • +1 (603) 548-7870
    • sales@set-na.com

    Technical Papers Quick Links:

    • Atmospheric Plasma
    • Die Bonders

    Information about SET Bonders:

    SET – Smart Equipment Technology, is the leading supplier of high accuracy Die-to-Die and Die-to-Wafer bonders.

    Visit set-sas.fr.

    Information about OES Plasma:

    ONTOS Equipment Systems, a sister company founded by SETNA, is a manufacturer of innovative devices for surface activation using room-temperature plasma.

    Visit ontosplasma.com.

    © 2026 — Setna, LLC

    • Home
    Prev