Ontos Equipment Systems joined the C2W Hybrid Bonding Consortium led by A*Star’s Institute of Microelectronics

See the IME press release MEMBERS OF THE CHIP-TO-WAFER HYBRID BONDING CONSORTIUM: A*STAR’s Institute of Microelectronics ASM Pacific (Hong Kong) Ltd Capcon Singapore Pte Ltd HD MicroSystems, Ltd ONTOS Equipment Systems, Corporation Panasonic Smart Factory Solutions Co., Ltd. SEKISUI CHEMICAL CO., LTD. Toray Industries, Inc. Yamaha Robotics Holdings Co.,...

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SEMICON Europe, Nov. 15-18, 2022, Munich, Germany

SEMICON-Europa – Meet us on Booth C1-126 Venue:Messe München, Munich, Germany. Exhibition hours: 9:00am to 6:00pm on Tuesday, November 15. 9:00am to 6:00pm on Wednesday, November 16. 9:00am to 6:00pm on Thursday, November 17. 9:00am to 4:00pm on Friday, November 18.     Surface Preparation with Ontos Atmospheric Plasma We shall be pleased to discuss the Advantages of our Clean Atmospheric Plasma (Ontos) for Surface...

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Quantum Computing: Metallurgy, Surface Preparation and Bonding for Cryogenic and Superconducting Hybrid Applications

Hybrid chip interconnect utilizing Indium is well-known in the production of hybrid chip assemblies that must operate at cryogenic temperatures. This technology has been used for decades in the Infrared Focalplane industry. Recent developments in Quantum Computing technology have now shown that Indium is also an excellent candidate for hybrid chip assemblies that operate at superconducting temperatures in the milli-Kelvin temperature...

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