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  • Home
  • About Us
    • Mission and History
    • Meet Our Team
  • Flip Chip Bonders
    • ACCµRA™ M
    • ACCµRA™ OPTO
    • ACCµRA™100
    • ACCµRA™ Plus
    • FC150 PLATINUM
    • FC300
    • LDP150
  • Atmospheric Plasma
    • ONTOS CLEAN
    • Atmospheric Plasma – OntosIS (OEM)
  • Delta Printing System
  • Other Products
    • MagVision Kerr Imaging System
    • AST IR Imaging Microscopes
  • Events & Technical Papers
    • Conferences / Exhibitions
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    • TP: Die Bonders
    • TP: Atmospheric Plasma
  • Contact Us

Comparison of Ontos7 Treated and Un-Treated Cu Plating Base

Home » Comparison of Ontos7 Treated and Un-Treated Cu Plating Base
Copper Plating

Comparison of Ontos7 Treated and Un-Treated Cu Plating Base

June 8, 2014 Posted by Setna Videos

Movie showing the significant improvement of the wetting after Atmospheric Plasma Treatment.

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About Setna

SETNA is a Manufacturing and Marketing, Sales and Service Organization. It is centered on our experience and know-how in high-accuracy bonding and the equipment, materials, competencies surrounding it including Surface Preparation with Atmospheric Plasma. SET Bonders have been the world-standard for applications in which micron precision post bond accuracy is required.

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