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  • Home
  • About Us
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    • ACCµRA™ OPTO
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Ontos Equipment Systems joined the C2W Hybrid Bonding Consortium led by A*Star’s Institute of Microelectronics

Home » Ontos Equipment Systems joined the C2W Hybrid Bonding Consortium led by A*Star’s Institute of Microelectronics
Ontos Equipment Systems joined the C2W Hybrid Bonding Consortium led by A*Star’s Institute of Microelectronics

Ontos Equipment Systems joined the C2W Hybrid Bonding Consortium led by A*Star’s Institute of Microelectronics

August 27, 2021 Posted by Setna Latest News

See the IME press release

MEMBERS OF THE CHIP-TO-WAFER HYBRID BONDING CONSORTIUM:
  • A*STAR’s Institute of Microelectronics
  • ASM Pacific (Hong Kong) Ltd
  • Capcon Singapore Pte Ltd
  • HD MicroSystems, Ltd
  • ONTOS Equipment Systems, Corporation
  • Panasonic Smart Factory Solutions Co., Ltd.
  • SEKISUI CHEMICAL CO., LTD.
  • Toray Industries, Inc.
  • Yamaha Robotics Holdings Co., Ltd.
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About Setna

SETNA is a Manufacturing and Marketing, Sales and Service Organization. It is centered on our experience and know-how in high-accuracy bonding and the equipment, materials, competencies surrounding it including Surface Preparation with Atmospheric Plasma. SET Bonders have been the world-standard for applications in which micron precision post bond accuracy is required.

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