• Home
  • About Us
    • Mission and History
    • Meet Our Team
  • Flip Chip Bonders
    • ACCµRA™ M
    • ACCµRA™ OPTO
    • ACCµRA™100
    • ACCµRA™ Plus
    • FC150 PLATINUM
    • FC300
    • LDP150
  • Atmospheric Plasma
    • ONTOS CLEAN
    • Atmospheric Plasma – OntosIS (OEM)
  • Delta Printing System
  • Other Products
    • MagVision Kerr Imaging System
    • AST IR Imaging Microscopes
  • Events & Technical Papers
    • Conferences / Exhibitions
    • C2W Hybrid Bonding Consortium
    • TP: Die Bonders
    • TP: Atmospheric Plasma
  • Contact Us

Call us today! +1 (603) 548-7870

Find our Location
[email protected]
Login

Login
SetnaSetna
SetnaSetna
  • Home
  • About Us
    • Mission and History
    • Meet Our Team
  • Flip Chip Bonders
    • ACCµRA™ M
    • ACCµRA™ OPTO
    • ACCµRA™100
    • ACCµRA™ Plus
    • FC150 PLATINUM
    • FC300
    • LDP150
  • Atmospheric Plasma
    • ONTOS CLEAN
    • Atmospheric Plasma – OntosIS (OEM)
  • Delta Printing System
  • Other Products
    • MagVision Kerr Imaging System
    • AST IR Imaging Microscopes
  • Events & Technical Papers
    • Conferences / Exhibitions
    • C2W Hybrid Bonding Consortium
    • TP: Die Bonders
    • TP: Atmospheric Plasma
  • Contact Us

Brandon James

Home » Brandon James

Brandon came to SET-NA with 6 years of experience as an Engineer at Oak Ridge National Laboratory’s Spallation Neutron Source.

He holds an associate degree in Mechanical Engineering Technology, and he has been with SET-NA since 2023.

Brandon James

Sales Engineer

Connect

Meet More Team Members

Matthew Phillips

Matthew Phillips

President/Founder

View Profile
Sandy Tran

Sandy Tran

Applications Engineer

View Profile
Mike Stead

Mike Stead

Product Specialist & Apps Support

View Profile
Leslie Meyer

Leslie Meyer

Administrative Assistant

View Profile

Contact Us:

  • Setna, LLC
  • 343 Meadow Fox Ln, Chester, NH 03036
  • +1 (603) 548-7870
  • sales@set-na.com

Technical Papers Quick Links:

  • Atmospheric Plasma
  • Die Bonders

Information about SET Bonders:

SET – Smart Equipment Technology, is the leading supplier of high accuracy Die-to-Die and Die-to-Wafer bonders.

Visit set-sas.fr.

Information about OES Plasma:

ONTOS Equipment Systems, a sister company founded by SETNA, is a manufacturer of innovative devices for surface activation using room-temperature plasma.

Visit ontosplasma.com.

© 2025 — Setna, LLC

  • Home
Prev