LDP150 Large Device Bonding Press
The LDP150 is an Electrical Press especially designed for bonding large light or radiation detectors (50 ~ 150 mm). It uses compression process at room temperature (thermo-compression option available). A predefined gap can be achieved between two components previously pre-bonded using a high accuracy device bonder such as the SET FC150.
The LDP 150 is able to apply force up to 100,000 N. The device is pressed at room temperature, preserving the initial high accuracy alignment and parallelism.
