FC300 High Precision Die / Flip Chip Bonder
The FC300 High Precision Die / Flip Chip Bonder is the newest generation of high accuracy and high force system for chip-to-chip and chip-to-wafer bonding, on wafers up to 300 mm.
The FC300 platform performs multiple applications including:
- High Force, particularly interesting for Cu-Cu bonding as used in 3D-IC packaging.
- Low Force Reflow Bonding for imaging devices, RF, or Optoelectronics assembly;
- UV-Curing for Adhesive Bonding
The tool features automated handling of chips and substrates up to 100 mm from waffle packs, plus a robotic option enabling chip picking from diced wafer and automated handling of larger substrates.
