FC150 PLATINUM Versatile Flip Chip Bonder
The high degree of flexibility offered on the FC150 PLATINUM makes it the machine of choice for advanced R&D and pilot line.
With ± 0.5 µm placement accuracy and 0.7 µm post-bond accuracy, the SET FC150 PLATINUM Flip Chip / Die Bonder serves the industry’s most demanding bonding requirements.
With configurations ranging from manual Step by Step to full automation, the FC150 PLATINUM provides development and production capabilities on a single upgradeable, cost-effective platform.
