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SetnaSetna
SetnaSetna
  • Home
  • About Us
    • Mission and History
    • Meet Our Team
  • Flip Chip Bonders
    • ACCµRA™ M
    • ACCµRA™ OPTO
    • ACCµRA™100
    • ACCµRA™ Plus
    • FC150 PLATINUM
    • FC300
    • LDP150
  • Atmospheric Plasma
    • ONTOS CLEAN
    • Atmospheric Plasma – OntosIS (OEM)
  • Delta Printing System
  • Other Products
    • MagVision Kerr Imaging System
    • AST IR Imaging Microscopes
  • Events & Technical Papers
    • Conferences / Exhibitions
    • C2W Hybrid Bonding Consortium
    • TP: Die Bonders
    • TP: Atmospheric Plasma
  • Contact Us

Events & Technical Papers

Home » Events & Technical Papers

  • C2W Hybrid Bonding Consortium

  • Events

  • Focus on Bonding

This section is a collection of technical papers and Conference Proceedings related to applications covered by the SET High Accuracy Device Bonders. It includes documents authored or co-authored by SETNA or SET and documents published by Users of these systems

  • Focus on Surface Preparation

This section is a collection of technical papers and Conference Proceedings related to applications covered by our Atmospheric Plasma System. It includes documents authored or co-authored by SETNA and documents published by Users of our system.

Contact Us:

  • Setna, LLC
  • 343 Meadow Fox Ln, Chester, NH 03036
  • +1 (603) 548-7870
  • sales@set-na.com

Technical Papers Quick Links:

  • Atmospheric Plasma
  • Die Bonders

Information about SET Bonders:

SET – Smart Equipment Technology, is the leading supplier of high accuracy Die-to-Die and Die-to-Wafer bonders.

Visit set-sas.fr.

Information about OES Plasma:

ONTOS Equipment Systems, a sister company founded by SETNA, is a manufacturer of innovative devices for surface activation using room-temperature plasma.

Visit ontosplasma.com.

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