Delta Printing System

DELTA Printing System

First truly additive method for printing single micron functional structures

Open Prototyping Platform, delivering reliable, repeatable, and durable results for high performance materials. Easy to operate and maintain. Ideal tool for R&D in various microelectronics applications.

Open platform for prototyping

Versatile technology for a range of R&D applications
Diverse resolutions
Expanding library of materials
Adjustable parameters
Continuous R&D innovations

Reliable, repeatable, and durable results for specific materials

Groundbreaking precision with high-resolution 3D printing (guaranteed 1 μm line printed during setup)
Extensive compatibility with high-resolution third-party inks
High precision and flawless uniformity in your printed traces
Unmatched electrical conductivity in printed traces, validated by pre-delivery and field-based proof-of-concept

Easy to operate and maintain

Seamless printing with our intuitive and simple-to-set printing parameters
Straightforward, rapid procedure for cartridge and nozzle installation
No need for post-printing cleanup
Delta design fits perfectly to any setting
System updates and development of new features

Benefits and Advantages

Feature sizes down to submicron scale
Wide range of material support
Printing on heterogeneous materials and 3D topographies
Uniform & clean feature geometries: no overspray, high linewidth homogeneity
Fast & easy exchange of cartridges & nozzles
Only 0.1 ml of ink required to start printing
Up to 100% ink utilization

Ultra-Precise Dispensing (UPD)

Ultra-high-resolution printing on various substrates
High-viscosity materials along with small feature sizes
High aspect ratios just after a single pass
Wide range of printable materials: metallic nanoparticle inks and pastes, quantum dot inks, dielectrics, polymers, photoresists, organic, liquid metal alloys and more
Uninterrupted interconnections on highly complex topographies

Applications to Various Industries

Semiconductors

High precision with submicron feature size
A wide range of materials supported for varied semiconductor fabrication needs
High aspect ratios, ideal for conductive power interconnections
Quick process enhances efficiency and ensures uniform, reliable end products
Printing on complex 3D surfaces More-than-Moore devices

Flexible Hybrid Electronics

Superior precision for Flexible Hybrid Electronics manufacturing
Reliable 3D chip interconnections directly on vertical slopes
Conductive and non-conductive materials for complex circuit patterns and reliable interconnections
High aspect ratios in a single pass
Uniform, clean geometries promote FHE device performance and Radio Frequency (RF) capabilities

Biosensors

Biosensing pattern fabrication on flexible substrates, vital for wearable sensors
Functionalized materials to prototype biosensors targeted at specific markers
Unparalleled precision for swift biosensor prototyping
Ability to print

Displays

Ultra-high resolution printing for OLED and microLED displays
Precision ideal for interconnections, microcavity filling, and defect repair
Dispensing of various display architecture elements, such as color conversion layers and interconnectors
Single-step, high-precision additive process increases yield and reduces production time and costs

Printed Circuit Boards

A wide variety of materials facilitating specific PCB structure creation and integration
High aspect ratio structures in a single pass
Printing on complex 3D

Key Features

Open defect repair

Dispensing ultra-high resolution features <1µm
Photonic sintering enabling resistance <1Ω/µm
Materials compatibility

Edge interconnections

Dispensing ultra-high resolution features <1µm
Photonic sintering enabling resistance <1Ω/µm
Materials compatibility

Microdots dispensing

Microdots printing
Excellent height to width aspect ratio
Capability to use conductive and non-conductive adhesives

Filling of microwells and TSV

Precise filling of microlavities, high aspect ratio vias, microwells
Variety of materials like: conductives, dielectrics, photoresist, quantum dots
Use-cases like QD color conversion, high-density TSV, RDL interconnection, sacrificial layer in MEMS fabrication

Printing through microchannels

Printing structures across dierent types of microchannels
Direct dispensing of conductive electrodes or photoresist (ex. SU-8)
Fast and reliable solution for microfluidic, med-tech and MEMS

Redistribution layer prototypying

All printed RDL structure
Down to 1µm / 1µm L/S density
Variable materials possible to use in one system, for example metalic nanoparticle paste and high viscous polyimide

3D micro-electronics printing

Directly on vertical step
No ramps needed
Reliable connection for flexible hybrid electronics and advanced IC packages

High-frequency structures

High resolution antenna on-chip
No satelite droplets and high uniformity to prevent high frequency signal loses
Wire-bonding interconnection alternative