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SetnaSetna
SetnaSetna
  • Home
  • About Us
    • Mission and History
    • Meet Our Team
  • Flip Chip Bonders
    • ACCµRA™ M
    • ACCµRA™ OPTO
    • ACCµRA™100
    • ACCµRA™ Plus
    • FC150 PLATINUM
    • FC300
    • LDP150
  • Atmospheric Plasma
    • ONTOS CLEAN
    • Atmospheric Plasma – OntosIS (OEM)
  • Delta Printing System
  • Other Products
    • MagVision Kerr Imaging System
    • AST IR Imaging Microscopes
  • Events & Technical Papers
    • Conferences / Exhibitions
    • C2W Hybrid Bonding Consortium
    • TP: Die Bonders
    • TP: Atmospheric Plasma
  • Contact Us

Videos

Home » Videos
Comparison of Ontos7 Treated and Un-Treated Cu Plating Base

Comparison of Ontos7 Treated and Un-Treated Cu Plating Base

Jun 8, 2014

Movie showing the significant improvement of the wetting after Atmospheric Plasma Treatment.

Ontos 7 Treated SAC bumps on Si Chip

Ontos 7 Treated SAC bumps on Si Chip

Jun 8, 2014

This video is showing the Wetting Improvement provided by the Ontos Atmospheric Plasma Surface Treatment

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  • 343 Meadow Fox Ln, Chester, NH 03036
  • +1 (603) 548-7870
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Technical Papers Quick Links:

  • Atmospheric Plasma
  • Die Bonders

Information about SET Bonders:

SET – Smart Equipment Technology, is the leading supplier of high accuracy Die-to-Die and Die-to-Wafer bonders.

Visit set-sas.fr.

Information about OES Plasma:

ONTOS Equipment Systems, a sister company founded by SETNA, is a manufacturer of innovative devices for surface activation using room-temperature plasma.

Visit ontosplasma.com.

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