ACCµRA™ 100: Education and R&D oriented, High Accuracy Flip-Chip Bonder
The ACCµRA™100 is a semi-automatic flip-chip bonder that guarantees ± 0.5 µm placement accuracy. Its flexibility makes it ideal for developing a wide range of applications. ACCµRA™100 combines high precision, accessibility and cost-effectiveness. It is the perfect equipment for universities and R&D institutes.
Highlights
- Post-bonding accuracy* (± 0,5 μm)
- Easy to use and very flexible
- Quick set-up of new applications
- Cost-effective
- Small footprint and compact design
- High bonding force
*depending on configuration and application.
