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SetnaSetna
SetnaSetna
  • Home
  • About Us
    • Mission and History
    • Meet Our Team
  • Flip Chip Bonders
    • ACCµRA™ M
    • ACCµRA™ OPTO
    • ACCµRA™100
    • ACCµRA™ Plus
    • FC150 PLATINUM
    • FC300
    • LDP150
  • Atmospheric Plasma
    • ONTOS CLEAN
    • Atmospheric Plasma – OntosIS (OEM)
  • Delta Printing System
  • Other Products
    • MagVision Kerr Imaging System
    • AST IR Imaging Microscopes
  • Events & Technical Papers
    • Conferences / Exhibitions
    • C2W Hybrid Bonding Consortium
    • TP: Die Bonders
    • TP: Atmospheric Plasma
  • Contact Us

Leslie Meyer

Home » Leslie Meyer

Leslie Meyer has been with SET North America since 2021. She is responsible for Accounts Receivable/Accounts Payable, shipping and receiving, and other administrative tasks for the company.

Prior to working with SET North America, Leslie taught English and Social Studies at the middle school level. Her background before teaching was in administration, sales, and support for a large data communications company.

Leslie Meyer

Administrative Assistant

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Meet More Team Members

Brandon James

Brandon James

Sales Engineer

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Mike Stead

Mike Stead

Product Specialist & Apps Support

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Mark Sohmer

Mark Sohmer

Director of Information Technology and Human Resources

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Sandy Tran

Sandy Tran

Applications Engineer

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Contact Us:

  • Setna, LLC
  • 343 Meadow Fox Ln, Chester, NH 03036
  • +1 (603) 548-7870
  • sales@set-na.com

Technical Papers Quick Links:

  • Atmospheric Plasma
  • Die Bonders

Information about SET Bonders:

SET – Smart Equipment Technology, is the leading supplier of high accuracy Die-to-Die and Die-to-Wafer bonders.

Visit set-sas.fr.

Information about OES Plasma:

ONTOS Equipment Systems, a sister company founded by SETNA, is a manufacturer of innovative devices for surface activation using room-temperature plasma.

Visit ontosplasma.com.

© 2025 — Setna, LLC

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