Matt Phillips has enjoyed serving in the Semiconductor industry for over 29 years, including 17 years with SET-NA, and 10 years with SUSS MicroTec, from 1995-2005.
In 2009 SET North America was formed; focusing on Sales, Marketing, applications and servicing of SET Corporation Die bonding equipment.
SET-NA has enjoyed very good success representing the SET equipment line, has established the SET name in North America and has built strategic partnerships with in our market space.
The SET-NA team has over 115 years of combined experience in the defense Aerospace industry.
