ACCµRA™ M: New Manual Flip-Chip Bonder
The ACCμRA™ M is a manual flip-chip bonder that allows ± 3 μm accuracy.
This equipment permits to align manually the components with a high level of precision. The motorized arm controls precisely the bonding force. Combining and synchronizing the arm with the temperature controller, it guarantees a perfect quality and high repeatability of your process.
The ACCμRA™ M, more than a pick-and-place system, offers thermocompression and reflow capabilities. It is the perfect equipment for universities and R&D institutes.
Highlights
- Accuracy* (± 3 μm)
- Process controlled thanks to closed loop systems
- Easy to use
- Granite structure offering high stiffness
- Vertical arm avoiding lateral shift during bonding
- Small footprint on open platform
*depending on configuration and application.
