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  • Home
  • About Us
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    • Meet Our Team
  • Flip Chip Bonders
    • ACCµRA™ M
    • ACCµRA™ OPTO
    • ACCµRA™100
    • ACCµRA™ Plus
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    • LDP150
  • Atmospheric Plasma
    • ONTOS CLEAN
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  • Delta Printing System
  • Other Products
    • MagVision Kerr Imaging System
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Ontos 7 Treated SAC bumps on Si Chip

Home » Ontos 7 Treated SAC bumps on Si Chip

Ontos 7 Treated SAC bumps on Si Chip

June 8, 2014 Posted by Setna Videos

This video is showing the Wetting Improvement provided by the Ontos Atmospheric Plasma Surface Treatment

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About Setna

SETNA is a Manufacturing and Marketing, Sales and Service Organization. It is centered on our experience and know-how in high-accuracy bonding and the equipment, materials, competencies surrounding it including Surface Preparation with Atmospheric Plasma. SET Bonders have been the world-standard for applications in which micron precision post bond accuracy is required.

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