LDP150 Large Device Bonding Press

The LDP150 is an Electrical Press especially designed for bonding large light or radiation detectors (50 ~ 150 mm). It uses compression process at room temperature (thermo-compression option available). A predefined gap can be achieved between two components previously pre-bonded using a high accuracy device bonder such as the SET FC150.

The LDP 150 is able to apply force up to 100,000 N. The device is pressed at room temperature, preserving the initial high accuracy alignment and parallelism.

  Self leveling sphere moving on air bearing and locked by vacuum preserves the initial parallelism of the component stack

  High force (up to 100,000N) and controlled force profile ensure bond join quality

  Granite base and rigid stiff steel structure maintain the initial high accuracy of the assembly

Component Size / Tooling
Component Size 50 ~ 150 mm
Component Thickness Up to 40 mm
Tool Thickness 15 mm
Tool Planarity < 1 µm
Vacuum Area (application specific)
Bonding Arm (Z axis)
Resolution 20 nm
Speed (maximum) 0.01 m/s
Bonding Profile Up to 10 steps Each step includes ramp and plateau
Parallelism Sphere
Travel Pivoting ± 1.5 degrees
Torque on Air Bearing (active) 0.5 N.cm
Force Measurement
Force range adjusted by swapping Force Sensors
• 10 kN Sensor Range, Accuracy, Sensitivity 100 – 10,000 N / 100 N / 10 N
• 50 kN Sensor Range, Accuracy, Sensitivity 500 – 50,000 N / 500 N / 50 N
• 100 kN Sensor Range, Accuracy, Sensitivity 1,000 – 100,000 N 1,000 N / 100 N
General Characteristics
Machine Footprint (L x D x H) 1415 x 1240 x 1820 mm
Machine Weight ~ 2,300 kg
Electrical Power Supply 208/230 V, 3 kVA, 50-60 Hz, 3 phases + ground

Data, design and specifications of custom built machines depend on individual process conditions and can vary accordingly to configurations. Not all specifications or options may be valid simultaneously. SET reserves the right to change machine specifications without prior notice.

The LDP150 accommodates a wide variety of materials, including extremely fragile materials such as GaAs and HgCdTe and processes:

  Room Temperature Compression

  Thermo-Compression (optional)

  Bonding is achieved by pressing the components together with accurate control of the force profile

  Priority can be given either to the force or to the gap variation

  Parallelism and gap are monitored at all time during the bonding sequence

The devices are pressed together at room temperature while preserving the initial high accuracy alignment and parallelism.

  Large Infrared Focal Plane Arrays for Military or Aerospace Applications

  Large XY, UV, Detectors