FC150 PLATINUM Versatile Flip Chip Bonder

The high degree of flexibility offered on the FC150 PLATINUM makes it the machine of choice for advanced R&D and pilot line.

With ± 0.5 µm placement accuracy and 0.7 µm post-bond accuracy, the SET FC150 PLATINUM Flip Chip / Die Bonder serves the industry’s most demanding bonding requirements.

With configurations ranging from manual Step by Step to full automation, the FC150 PLATINUM provides development and production capabilities on a single upgradeable, cost-effective platform.

  0.7 μm post-bond accuracy thanks to 0.1 μm alignment accuracy.

  High magnification microscope for a sharp image of the components.

  Easy to use, quick set-up of new applications.

  Control of parallelism to guarantee very high accuracy even under high forces.

  Manual (step by step) and automatic mode

  Process recording for development, log files to track production

Bonding processes

  • Flip-chip bonding / die bonding
  • Thermocompression
  • Thermosonic
  • Reflow
  • UV / Thermal curing adhesives, polymers


  • Gold
  • Gold/Tin
  • Indium
  • Copper
  • Adhesive


  • Chip-to-Chip
  • Chip-to-Wafer
  • Optoelectronics
  • Silicon photonics
  • Focal plane arrays
  • Infrared and X-Ray image sensors
  • 3D-integration, memory stacking
  • Nanoimprinting


  • Telecommunication, 5G, 6G
  • Quantum
  • Automotive
  • Defense
  • HPC
  • Artificial Intelligence
  • Virtual Reality

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