ACCURA™ Plus

ACCURA™ Plus : Dedicated to production for Optoelectronic and Silicon photonics applications.

The ACCµRA™ Plus is a flip-chip bonder designed for ± 0.5 μm accuracy in full automatic mode. It is suitable for reflow and thermocompression processes.

ACCµRA™ Plus combines high precision, flexibility and short cycle time.

*depending on configuration and application.


High accuracy and high throughput

Fully automatic

High flexibility and reliability

Ultra-small dies

Please use the form below to request a datasheet (specify the model) or/and ask questions.

    Process Capabilities

    Flip-chip bonding

    Die bonding

    Thermocompression

    Reflow

    UV curing

    Gold, Gold/Tin, Indium, Copper

    Pick & Place

    Applications

    Laser Diodes, Laser Bars

    VCSEL, photo diode

    LED

    Prisms, Lenses, Mirrors

    Micro Assembly

    Flip-chip bonding, die bonding

    Chip-to-chip, chip-to-substrate bonding