ACCµRA 100: Education and R&D oriented, High Accuracy Flip-Chip Bonder
The ACCµRA™100 is a semi-automatic flip-chip bonder that guarantees ± 0.5 µm placement accuracy. Its flexibility makes it ideal for developing a wide range of applications. ACCµRA™100 combines high precision, accessibility and cost-effectiveness. It is the perfect equipment for universities and R&D institutes.
- Post-bonding accuracy* (± 0,5 μm)
- Easy to use and very flexible
- Quick set-up of new applications
- Small footprint and compact design
- High bonding force
*depending on configuration and application.
Open platform associated to an intuitive interface results in a quick set-up for new applications
Robust design and closed loop systems guarantee a high repeatability in operations
It combines on the same platform high precision, low to high force and user-friendly interface for multiple applications and processes
Please use the form below to request a datasheet (specify the model) or/and ask questions.
Main bonding processes
Pick and place
Gold, Gold/Tin, Indium, Copper
UV or thermal cure adhesives
Laser diode, laser bar
VCSEL, photo diode
Flip-chip bonding, die bonding
Chip-to-chip, chip-to-substrate bonding
MOEMS, MEMS, MCM packaging…
Nanoimprinting (UV NIL and Hot Embossing)