ACCµRA Plus

ACCµRA Plus : Dedicated to production for Optoelectronic and Silicon photonics applications.

The ACCµRA Plus is a flip-chip bonder designed for ± 0.5 μm accuracy in full automatic mode. It is suitable for reflow and thermocompression processes.

ACCμRA Plus combines high precision, flexibility and short cycle time.

*depending on configuration and application.


High accuracy and high throughput

Fully automatic

High flexibility and reliability

Ultra-small dies

Please use the form below to request a datasheet (specify the model) or/and ask questions.

Process Capabilities

Flip-chip bonding

Die bonding

Thermocompression

Reflow

UV curing

Gold, Gold/Tin, Indium, Copper

Pick & Place

Applications

Laser Diodes, Laser Bars

VCSEL, photo diode

LED

Prisms, Lenses, Mirrors

Micro Assembly

Flip-chip bonding, die bonding

Chip-to-chip, chip-to-substrate bonding