ACCµRA Plus : Dedicated to production for Optoelectronic and Silicon photonics applications.
The ACCµRA Plus is a flip-chip bonder designed for ± 0.5 μm accuracy in full automatic mode. It is suitable for reflow and thermocompression processes.
ACCμRA Plus combines high precision, flexibility and short cycle time.
*depending on configuration and application.
High accuracy and high throughput
High flexibility and reliability
Please use the form below to request a datasheet (specify the model) or/and ask questions.
Gold, Gold/Tin, Indium, Copper
Pick & Place
Laser Diodes, Laser Bars
VCSEL, photo diode
Prisms, Lenses, Mirrors
Flip-chip bonding, die bonding
Chip-to-chip, chip-to-substrate bonding