ACCµRA OPTO: Optoelectronics and Silicon Photonics,

High Accuracy Flip-Chip Bonder 0.5 μm

The ACCµRA OPTO is a flip-chip bonder that allows ± 0.5 μm accuracy. It is dedicated to low force and reflow processes. Motorized axes guarantee a high repeatability of your process.

The ACCμRA Opto combines high precision, flexibility and accessibility. It is the perfect equipment for optoelectronics and silicon photonics applications.


  • Post-bonding accuracy* (± 0,5 μm)
  • Low Force Bonding
  • Confining Gas
  • Easy to use and very flexible
  • Quick set-up of new applications
  • Small footprint and compact design

*depending on configuration and application.

Open platform associated to an intuitive interface results in a quick set-up for new applications

Robust design and closed loop systems guarantee a high repeatability in operations

High precision, accurate control of low forces and user-friendly interface for multiple applications and processes.

Please use the form below to request  a datasheet (specify the model) or/and ask questions.

Main bonding processes

Flip-chip bonding

Die bonding

Pick and place



UV curing

Gold, Gold/Tin, Indium, Copper

Main Applications

Laser diode, laser bar

VCSEL, photo diode


Prisms, Lenses, Mirrors assembly

Micro assembly

Flip-chip bonding, die bonding

Chip-to-chip, chip-to-substrate bonding

Nanoimprinting (UV NIL and Hot Embossing)