ACCµRA M: New Manual Flip-Chip Bonder

The ACCμRA M is a manual flip-chip bonder that allows ± 5 μm accuracy. This equipment permits to align manually the components with a high level of precision. The motorized arm controls precisely the bonding force. Combining and synchronizing the arm with the temperature controller, it guarantees a perfect quality and high repeatability of your process. The ACCμRA M, more than a pick-and-place system, offers thermocompression and reflow capabilities. It is the perfect equipment for universities and R&D institutes.


  • Accuracy* (± 0,5 μm)
  • Process controlled thanks to closed loop systems
  • Easy to use
  • Granite structure offering high stiffness
  • Vertical arm avoiding lateral shift during bonding
  • Very small footprint on open platform

*depending on configuration and application.

Open platform with simple user interface on touchscreen

Quick start for new applications

Superimposed images for easy manual alignment

Bonding controlled by the machine to guarantee a high repeatability from sample to sample.

Components Size
Chip (Upper Component) 0.2 ~ 22 mm (square)
Substrate (Lower Component) 0.2 ~ 100 mm (square)
Total Thickness (Lower Component) 0,05 ~ 7 mm
Bonding Arm
Accuracy ± 0.5 μm
Z resolution 0.01 μm
Force Low Force: 0.2 up to 10NHigh Force: 1 up to 200N
Ultrasonic 55- 65 kHz, 40 W max.
UV-Curing (UV Pen) Exposed area: diameter 10mmWavelength: 365 nmPower up to 80 mW/cm²
Alignment Stage
XY stage Manual
Theta Travel ± 5 degrees, Resolution 20 μradian
Bonding Heads
Room Temperature Square 22 mm
Heating Square 22 mm, 400°C
UV 80 mW/cm² @ 365 nm
Substrate Chucks
Room Temperature Square 50 or 100mm
Heating Square 22, 50 or 100mm, 400°C
Digital camera resolution 2 sight cameras 0,4 µm/pixel
Field of View 800 x 600 µm
Dispenser Process recording
XY high resolution alignment stage (1 μm) Frame with elastomeric insulators
UV Curing system (UV Pen) Wafer frame up to Ø200 mm
Ultrasonic transducer
General Characteristics
Machine Footprint 900 x 550 mm
Machine Height 650mm
Machine Weight ~110 kg

*Data, design and specifications depend on individual process conditions and can vary according to equipment configurations. Not all specifications may be valid simultaneously. Illustrations, photos and specifications in this datasheet are not legally binding. Specifications are subject to change without prior notice.

Main bonding processes

Flip-chip bonding

Die bonding

Pick and place


UV curing


Gold, Gold/Tin, Indium, Copper

Main Applications

Micro assembly

Laser diode, laser bar

VCSEL, photo diode


Flip-chip bonding, die bonding

Chip-to-chip, chip-to-substrate bonding

MOEMS, MEMS, MCM packaging…