Conférences / Exhibitions

Exhibitions to which SETNA participate are shown below. Click on events for details.

SPIE – Photonics West, Jan. 31- Feb. 2023, Moscone Center, San Francisco CA, USA

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Venue: Photonics West – Moscone Center, San Francisco, CA. Meet us on the SET (Smart Equipment Technology) booth #4531 Exhibition hours: 10:00 AM – 5:00 PM – Tuesday 31 January 10:00 AM – 5:00 PM – Wednesday 1 February 10:00 AM – 4:00 PM – Thursday 2 February High Accuracy Flip-Chip Bonders and Surface Preparation using Atmospheric Plasma We shall be pleased to welcome you on the SET Booth to discuss accurate Die/Flip Chip bonding and surface preparation for bonding and other applications.   High...

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OFC 2023, March 5-9, San Diego, CA, USA

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Venue: OFC 2023, San Diego Convention Center, California, USA Meet us on SET Corporation booth #5406 Exhibition hours: Tuesday, March 7         >> 10:00 am – 5:00 pm Wednesday, March 8  >> 10:00 am – 5:00 pm Thursday, March 9       >> 10:00 am – 4:00 pm High Accuracy Flip-Chip Bonders and Surface Preparation using the ONTOS Atmospheric Plasma High Accuracy Die / Flip Chip Bonding SETNA distribute the SET Corporation Bonders in North America. We shall be pleased to present the ACCµRA Bonder Series, including...

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IMAPS Device Packaging 2023, March 13-16, Fountain Hills, AZ, USA

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19th International Conference and Exhibition on Device Packaging Venue: WekoPa Resort and Casino, Fountain Hills, Arizona USA. Exhibition hours: 10:00am to 6:00pm on Tuesday 14th. 10:00am to 4:00pm on Wednesday 15th. Surface Preparation using Atmospheric Plasma and High Accuracy Flip-Chip Bonders.     Surface Preparation using Atmospheric Plasma We shall be pleased to discuss the Advantages of our Atmospheric Plasma (ONTOS) for Surface Preparation. It is applicable to numerous process steps for Semiconductor Manufacturing or...

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ECTC 2023 | May 30-June 2, 2023 | Orlando, FL, USA

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Venue: ECTC 2023 – JW Marriott Orlando, Grande Lakes, Florida. Exhibition hours: Wednesday, May 31 >> 9:00 am – noon & 1:30 – 6:30 pm Thursday, June 1    >> 9:00 am – noon & 1:30 – 4:00 pm We shall be pleased to welcome you to the SET/SETNA Booth #437 to discuss accurate Die/Flip Chip bonding and surface preparation for bonding and other applications. High Accuracy Die / Flip Chip Bonding SETNA distribute the SET Corporation Bonders in North America. We shall be pleased to present the ACCµRA...

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SEMICON West, July 11-13, 2023, Moscone Center, San Francisco CA, USA

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SEMICON-West – Meet us on SET Corporation booth #461 (South Hall) Venue: Moscone Center, San Francisco, CA. Exhibition hours: 10:00am to 5:00pm on Tuesday, July 11. 10:00am to 5:00pm on Wednesday, July 12. 10:00am to 4:00pm on Thursday, July 13. High Accuracy Flip-Chip Bonders and Surface Preparation for Bonding using Atmospheric Plasma     High Accuracy Die / Flip Chip Bonding SETNA distribute the SET Corporation Bonders in North America. We shall be pleased to present the ACCµRA Bonder Series, including a Research Table Top...

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