Conférences / Exhibitions

Metallurgy, Surface Preparation and Bonding for Cryogenic and Superconducting Hybrid Applications

Posted by on 10:03 am in Latest News | 0 comments

  Hybrid chip interconnect utilizing Indium is well-known in the production of hybrid chip assemblies that must operate at cryogenic temperatures. This technology has been used for decades in the Infrared Focalplane industry. Recent developments in Quantum Computing technology have now shown that Indium is also an excellent candidate for hybrid chip assemblies that operate at superconducting temperatures in the milli-Kelvin temperature range. This Paper by the Quantum Computing groups at Google and UCSB describes the materials and processes...

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