IWLPC 2018, October 23-25, 2018, San Jose, CA, USA
IWLPC – International Wafer-Level Packaging Conference and Tabletop Exhibition Venue: DoubleTree by Hilton, San Jose, California, USA. Exhibition hours: Tuesday 23 — 10:00am to 5:00pm (Reception: 5:30pm to 7:00pm). Wednesday 24 — 9:30am to 3:30pm. We shall be pleased to welcome you to the SETNA/SET Booth #11 to discuss accurate Die/Flip Chip bonding and surface preparation for bonding and other applications. High Accuracy Die / Flip Chip Bonding SETNA distributes the SET Corporation Bonders in North America. We shall...
read moreSEMICON Europe 2018, Nov. 13-16, Munich, Germany
SEMICON-Europa – Meet us on Booth A4-354 Venue:Messe München, Munich, Germany. Exhibition hours: 9:00am to 6:00pm on Tuesday, November 13. 9:00am to 6:00pm on Wednesday, November 14. 9:00am to 6:00pm on Thursday, November 15. 9:00am to 4:00pm on Friday, November 16. Surface Preparation with Ontos Atmospheric Plasma We shall be pleased to discuss the Advantages of our Clean Atmospheric Plasma (Ontos) for Surface Preparation. It is applicable to numerous process steps for Semiconductor Manufacturing or Assembly. Ontos is also ...
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