Metallurgy, Surface Preparation and Bonding for Cryogenic and Superconducting Hybrid Applications
Hybrid chip interconnect utilizing Indium is well-known in the production of hybrid chip assemblies that must operate at cryogenic temperatures. This technology has been used for decades in the Infrared Focalplane industry. Recent developments in Quantum Computing technology have now shown that Indium is also an excellent candidate for hybrid chip assemblies that operate at superconducting temperatures in the milli-Kelvin temperature range. This Paper by the Quantum Computing groups at Google and UCSB describes the materials and processes...
read more69th ECTC, May 28-31, 2019, Las Vegas, NV, USA
The Electronic Components and Technology Conference (ECTC) is sponsored by the Components, Packaging and Manufacturing Technology (CPMT) Society of the IEEE. Venue: The Cosmopolitan of Las Vegas. Exhibition hours: Wednesday, May 29 >> 9:00 am – noon & 1:30 – 6:30 pm Thursday, May 30 >> 9:00 am – noon & 1:30 – 4:00 pm We shall be pleased to welcome you to the SET/SETNA Booth #423 to discuss accurate Die/Flip Chip bonding and surface preparation for bonding and other applications. High Accuracy Die...
read moreSEMICON West, July 9-11, 2019, Moscone Center, San Francisco CA, USA
SEMICON-West – Meet us on booth #6365 (North Hall) Venue: Moscone Center, San Francisco, CA. Exhibition hours: 10:00am to 5:00pm on Tuesday, July 9. 10:00am to 5:00pm on Wednesday, July 10. 10:00am to 4:00pm on Thursday, July 11. SET/SETNA (Booth #6365): High Accuracy Flip-Chip Bonders and Surface Preparation using Atmospheric Plasma We shall be pleased to welcome you on the SET Booth to discuss accurate Die/Flip Chip bonding and surface preparation for bonding and other applications. High Accuracy Die / Flip Chip Bonding SETNA...
read moreIWLPC – October 22-24, 2018 – San Jose, CA, USA
IWLPC – International Wafer-Level Packaging Conference and Tabletop Exhibition Venue: DoubleTree by Hilton, San Jose, California, USA. Exhibition hours: Tuesday 22 — 10:00am to 5:00pm (Reception: 5:30pm to 7:00pm). Wednesday 23 — 9:30am to 3:30pm. We shall be pleased to welcome you to the SETNA/SET Booth #11 to discuss accurate Die/Flip Chip bonding and surface preparation for bonding and other applications. High Accuracy Die / Flip Chip Bonding SETNA distribute the SET Corporation Bonders in North America. We shall...
read moreSEMICON Europe, Nov. 12-15, 2019, Munich, Germany
SEMICON-Europa – Meet us on Booth B1-657 Venue:Messe München, Munich, Germany. Exhibition hours: 9:00am to 6:00pm on Tuesday, November 12. 9:00am to 6:00pm on Wednesday, November 13. 9:00am to 6:00pm on Thursday, November 14. 9:00am to 4:00pm on Friday, November 15. Surface Preparation with Ontos Atmospheric Plasma We shall be pleased to discuss the Advantages of our Clean Atmospheric Plasma (Ontos) for Surface Preparation. It is applicable to numerous process steps for Semiconductor Manufacturing or Assembly. Ontos is also ...
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