70th ECTC, May 26-29, 2020, Lake Buena Vista, FL, USA
The Electronic Components and Technology Conference (ECTC) is sponsored by the Components, Packaging and Manufacturing Technology (CPMT) Society of the IEEE. Venue: Walt Disney World Swan and Dolphin Resort. Exhibition hours: Wednesday, May 27 >> 9:00 am – noon & 1:30 – 6:30 pm Thursday, May 28 >> 9:00 am – noon & 1:30 – 4:00 pm We shall be pleased to welcome you to the SET/SETNA Booth #TBD to discuss accurate Die/Flip Chip bonding and surface preparation for bonding and other applications. High...
read moreSEMICON West, July 21-23, 2020, Moscone Center, San Francisco CA, USA
SEMICON-West – Meet us on booth #6164 (North Hall) Venue: Moscone Center, San Francisco, CA. Exhibition hours: 10:00am to 5:00pm on Tuesday, July 21. 10:00am to 5:00pm on Wednesday, July 22. 10:00am to 4:00pm on Thursday, July 23. High Accuracy Flip-Chip Bonders and Surface Preparation using Atmospheric Plasma We shall be pleased to welcome you on the SET Booth to discuss accurate Die/Flip Chip bonding and surface preparation for bonding and other applications. High Accuracy Die / Flip Chip Bonding SETNA distribute the SET...
read moreMetallurgy, Surface Preparation and Bonding for Cryogenic and Superconducting Hybrid Applications
Hybrid chip interconnect utilizing Indium is well-known in the production of hybrid chip assemblies that must operate at cryogenic temperatures. This technology has been used for decades in the Infrared Focalplane industry. Recent developments in Quantum Computing technology have now shown that Indium is also an excellent candidate for hybrid chip assemblies that operate at superconducting temperatures in the milli-Kelvin temperature range. This Paper by the Quantum Computing groups at Google and UCSB describes the materials and processes...
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