IMAPS Device Packaging 2020, March 3-5, AZ, USA
16th International Conference and Exhibition on Device Packaging Venue: WekoPa Resort and Casino, Fountain Hills, Arizona USA. Exhibition hours: 10:00am to 6:30pm on Tuesday 3th. 10:00am to 4:00pm on Wednesday 4th. Surface Preparation using Atmospheric Plasma and High Accuracy Flip-Chip Bonders. Surface Preparation using Atmospheric Plasma We shall be pleased to discuss the Advantages of our Atmospheric Plasma (ONTOS) for Surface Preparation. It is applicable to numerous process steps for Semiconductor Manufacturing or Assembly, and it...
read moreOFC 2020, March 8-12, San Diego, CA, USA
The Optical Networking and Communication Conference & Exhibition OFC is the largest global conference and exhibition for optical communications and networking professionals. Venue: San Diego Convention Center, San Diego, California, USA Exhibition hours: Tuesday, March 10 >> 10:00 am – 5:00 pm Wednesday, March 11 >> 10:00 am – 5:00 pm Thursday, March 12 >> 10:00 am – 4:00 pm SETNA (Booth #3049): High Accuracy Flip-Chip Bonders and Surface Preparation using Atmospheric Plasma We shall be pleased to...
read more70th ECTC, May 26-29, 2020, Lake Buena Vista, FL, USA
The Electronic Components and Technology Conference (ECTC) is sponsored by the Components, Packaging and Manufacturing Technology (CPMT) Society of the IEEE. Venue: Walt Disney World Swan and Dolphin Resort. Exhibition hours: Wednesday, May 27 >> 9:00 am – noon & 1:30 – 6:30 pm Thursday, May 28 >> 9:00 am – noon & 1:30 – 4:00 pm We shall be pleased to welcome you to the SET/SETNA Booth #TBD to discuss accurate Die/Flip Chip bonding and surface preparation for bonding and other applications. High...
read moreSEMICON West, July 21-23, 2020, Moscone Center, San Francisco CA, USA
SEMICON-West – Meet us on booth #6164 (North Hall) Venue: Moscone Center, San Francisco, CA. Exhibition hours: 10:00am to 5:00pm on Tuesday, July 21. 10:00am to 5:00pm on Wednesday, July 22. 10:00am to 4:00pm on Thursday, July 23. High Accuracy Flip-Chip Bonders and Surface Preparation using Atmospheric Plasma We shall be pleased to welcome you on the SET Booth to discuss accurate Die/Flip Chip bonding and surface preparation for bonding and other applications. High Accuracy Die / Flip Chip Bonding SETNA distribute the SET...
read moreMetallurgy, Surface Preparation and Bonding for Cryogenic and Superconducting Hybrid Applications
Hybrid chip interconnect utilizing Indium is well-known in the production of hybrid chip assemblies that must operate at cryogenic temperatures. This technology has been used for decades in the Infrared Focalplane industry. Recent developments in Quantum Computing technology have now shown that Indium is also an excellent candidate for hybrid chip assemblies that operate at superconducting temperatures in the milli-Kelvin temperature range. This Paper by the Quantum Computing groups at Google and UCSB describes the materials and processes...
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