IMAPS Device Packaging | March 5-7, 2025 | Phoenix, Arizona, USA
21st International Conference and Exhibition on Device Packaging
Venue: Sheraton at Wild Horse Pass, Phoenix, Arizona, USA.
Exhibition hours:
- 10:00am to 6:00pm on Tuesday 19th.
- 10:00am to 4:00pm on Wednesday 20th.
We shall be pleased to welcome you to the SETNA Booth #213, to discuss accurate Die/Flip Chip bonding and Atmospheric Plasma Surface Preparation for bonding and other applications.
Surface Preparation using Atmospheric Plasma
Introducing the New System ONTOS CLEAN
We shall be pleased to discuss the Advantages of our Atmospheric Plasma (ONTOS) for Surface Preparation. It is applicable to numerous process steps for Semiconductor Manufacturing or Assembly, and it can be integrated into production machines.
Applications include:
- photoresist de-scum & activation,
- preparation for Plating,
- photomask cleaning,
- bonding (de-oxidation, protection against re-oxidation),
- preparation for Capillary underfill,
- surface activation for die attach adhesion, etc.
High Accuracy Die / Flip Chip Bonding
SETNA distribute the SET Corporation Bonders in North America. We shall be pleased to present the SET Die Bonder Product line, including a Research Table Top Machine dedicated to Universities and Production Flip Chip / Die Bonders for Optoelectronic and Silicon photonics applications.
. We shall introduce the New Flip Chip Bonder FC150 PLATINUM, the machine of choice for advanced R&D with the ability to move directly into pilot line.