SEMICON West, July 12-14, 2022, Moscone Center, San Francisco CA, USA

Semicon West

SEMICON-WestMeet us on SET Corporation booth #5768 (South Hall)

Venue: Moscone Center, San Francisco, CA.

Exhibition hours:

  • 10:00am to 5:00pm on Tuesday, July 12.
  • 10:00am to 5:00pm on Wednesday, July 13.
  • 10:00am to 4:00pm on Thursday, July 14.

High Accuracy Flip-Chip Bonders and Surface Preparation for Bonding using Atmospheric Plasma

We shall be pleased to welcome you on the SET Booth to discuss accurate Die/Flip Chip bonding and surface preparation for bonding application and others.

 

 

SET Die/Flip Chip Bonder Accura Plus

 

High Accuracy Die / Flip Chip Bonding

SETNA distribute the SET Corporation Bonders in North America. We shall be pleased to present the ACCµRA Bonder Series, including a Research Table Top Machine dedicated to Universities. He will be also pleased to share information about the progress of the Future Equipment for High Volume Production, especially for 3D-Integration and Optoelectronic applications.

 

 

Surface Preparation using Atmospheric Plasma

We shall be pleased to discuss the Advantages of our Atmospheric Plasma (ONTOS) for Surface Preparation. It is applicable to numerous process steps for Semiconductor Manufacturing or Assembly, and it can be integrated into production machines.

Applications include:

  • photoresist de-scum & activation,
  • preparation for Plating,
  • photomask cleaning,
  • bonding (de-oxidation, protection against re-oxidation),
  • preparation for Capillary underfill,
  • surface activation for die attach adhesion, etc.

Author: Gilbert

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