ECTC | May 28-31, 2024 | Denver, Colorado, USA

Gaylord Rockies Resort & Convention Center, Denver Colorado

Venue: Gaylord Rockies Resort & Convention Center, Denver Colorado.

Exhibition hours:

  • Wednesday, May 29 >> 9:00 am – noon & 1:30 – 6:30 pm
  • Thursday, May 30    >> 9:00 am – noon & 1:30 – 4:00 pm

We shall be pleased to welcome you to the SETNA Booth to discuss accurate Die/Flip Chip bonding and Atmospheric Plasma Surface Preparation for bonding and other applications.

 

 

Surface Preparation using Atmospheric Plasma

Introducing the New System ONTOS CLEAN.

We shall be pleased to discuss the Advantages of our ONTOS Atmospheric Plasma for Surface Preparation. Applicable to numerous process steps for Semiconductor Manufacturing or Assembly, it can be integrated into production machines.

Applications include:

  • photoresist de-scum & activation,
  • preparation for Plating,
  • photomask cleaning,
  • bonding (de-oxidation, protection against re-oxidation),
  • preparation for Capillary underfill,
  • surface activation for die attach adhesion, etc.

High Accuracy Die / Flip Chip Bonding

SETNA distribute the SET Corporation Bonders in North America. We shall be pleased to present the SET Die Bonder Product line, including a Research Table Top Machine dedicated to Universities and Production Flip Chip / Die Bonders for Optoelectronic and Silicon photonics applications.

. We shall introduce the New Flip Chip Bonder FC150 PLATINUM, the machine of choice for advanced R&D with the ability to move directly into pilot line.

Author: Gilbert

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