High-accuracy Bonding and Plasma Surface Preparation
SETNA is a Manufacturing and Marketing, Sales and Service Organization. It is centered on our experience and know-how in high-accuracy bonding and the equipment, materials, competencies surrounding it including Surface Preparation with Atmospheric Plasma.
SET Die / Flip Chip Bonders have been the world-standard for applications in which micron precision post bond accuracy is required. For more than twenty years the FC150 Series has been the tool of choice. The FC300 series bonders provide the highest force and bonding accuracy available in the industry. The ACCµRA series provide accurate and versatile die bonders for education and R&D.
ONTOS is the atmospheric plasma system, designed by our sister company OES (ONTOS Equipment systems), for and dedicated exclusively to the semiconductor manufacturing and packaging industry. Our patented (and patent pending) equipment and processes provide a unique advantage to our customers. It enables low-cost, high yield, high-speed, chip-to-chip interconnect bonds at room temperature with minimal force. ONTOS Atmospheric Plasma also improves surface activation for direct bonding, aqueous wetting, contamination removal, adhesive bonding, and more.