LDP150 Large Device Bonding Press
The LDP150 is an Electrical Press especially designed for bonding large light or radiation detectors (50 ~ 150 mm). It uses compression process at room temperature (thermo-compression option available). A predefined gap can be achieved between two components previously pre-bonded using a high accuracy device bonder such as the SET FC150.
The LDP 150 is able to apply force up to 100,000 N. The device is pressed at room temperature, preserving the initial high accuracy alignment and parallelism.
Self leveling sphere moving on air bearing and locked by vacuum preserves the initial parallelism of the component stack
High force (up to 100,000N) and controlled force profile ensure bond join quality
Granite base and rigid stiff steel structure maintain the initial high accuracy of the assembly
|Component Size / Tooling|
|Component Size||50 ~ 150 mm|
|Component Thickness||Up to 40 mm|
|Tool Thickness||15 mm|
|Tool Planarity||< 1 µm|
|Vacuum Area||(application specific)|
|Bonding Arm (Z axis)|
|Speed (maximum)||0.01 m/s|
|Bonding Profile||Up to 10 steps Each step includes ramp and plateau|
|Travel Pivoting||± 1.5 degrees|
|Torque on Air Bearing (active)||0.5 N.cm|
|Force range adjusted by swapping Force Sensors|
|• 10 kN Sensor Range, Accuracy, Sensitivity||100 – 10,000 N / 100 N / 10 N|
|• 50 kN Sensor Range, Accuracy, Sensitivity||500 – 50,000 N / 500 N / 50 N|
|• 100 kN Sensor Range, Accuracy, Sensitivity||1,000 – 100,000 N 1,000 N / 100 N|
|Machine Footprint (L x D x H)||1415 x 1240 x 1820 mm|
|Machine Weight||~ 2,300 kg|
|Electrical Power Supply||208/230 V, 3 kVA, 50-60 Hz, 3 phases + ground|
Data, design and specifications of custom built machines depend on individual process conditions and can vary accordingly to configurations. Not all specifications or options may be valid simultaneously. SET reserves the right to change machine specifications without prior notice.
The LDP150 accommodates a wide variety of materials, including extremely fragile materials such as GaAs and HgCdTe and processes:
Room Temperature Compression
Bonding is achieved by pressing the components together with accurate control of the force profile
Priority can be given either to the force or to the gap variation
Parallelism and gap are monitored at all time during the bonding sequence
The devices are pressed together at room temperature while preserving the initial high accuracy alignment and parallelism.
Large Infrared Focal Plane Arrays for Military or Aerospace Applications
Large XY, UV, Detectors