FC150

FC150 Automated Die / Flip Chip Bonder

The high degree of flexibility offered on the FC150 makes it the machine of choice for advanced research and pilot production. With ± 0.5 µm placement accuracy and ± 1 µm post-bond accuracy, the SET FC150 Die/Flip Chip Bonder serves the industry’s most demanding bonding requirements. With configurations ranging from manual to full automation, the FC150 provides development and production capabilities on a single upgradeable, cost-effective platform.

The FC150 supports a complete range of bonding applications, including ReflowThermo-compression, Thermosonic, Adhesive and Fusion bonding. Active leveling is made possible through a motorized pitch & roll system combined with autocollimation or laser leveling. Able to level, align and bond components ranging in size from 0.2 to 100 mm, and engineered to maximize accuracy and versatility, the FC150 answers almost every need in high-end bonding applications.

  ± 1 µm 3 sigma post-bond accuracy and 20 µradian leveling guarantee high yields on the most advanced products

  Semi-Open Confinement Chamber for Oxide Reduction (option)

  Air bearing construction on a granite structure ensures long-term stability and reliability   Compression, Z-control and temperature profiling, together with process monitoring, maximize process control

  Optical automatic leveling and alignment enables hands-off operation for production applications

  Nanoimprint Lithography option with Hot Embossing or UV-NIL process without compromising the bonding capability

PROCESS STATION

Components Size
Chip (Upper Component) 0.2 ~ 100 mm

Thickness up to 2 mm

Substrate (Upper Component) 0.5 ~ 150 mm (option 200 mm)

Thickness up to 6 mm

Bonding Arm: Universal Bonding Arm
Placement Accuracy ± 1 μm @ 3 sigma*
Post-Bonding Accuracy 1 ~ 3 μm*
Leveling Travel ± 0.57 degrees, Resolution 2 μrad
Z Travel 178 mm, Resolution 0.5 μm
Force 0.3 to 500 N (1,000 and 2,000 N optional)
Bonding Arm: SET Reflow Arm
Post-Bonding Accuracy ± 1 μm @ 3 sigma*
Leveling Travel ± 0.5 degrees, Resolution 0.05 μrad
Z Travel 162 mm, Resolution 0.5 µm
Force 0.2 ~ 4 N
Alignment Stage
XY stage Travel 300 x 250 mm, Resolution 0.1 μm
Theta Travel ± 7 degrees, Resolution 8.3 μradian
Z Travel 11 mm, Resolution 0.25 µm
Bonding Heads
Room Temperature Up to Sq. 100 mm sq. 22, 50, 100, 150, 200 mm
Heating RT to 450°C, Resolution 1°C
Substrate Chucks
Room Temperature Up to Sq. 150 mm (option 200 mm)
Heating RT to 450°C, Resolution 1°C
Optics
XY Inspection Travel 100 x 95 mm, Resolution 1 µm
Autocollimator Sensitivity 20 µrad on mirror

(component roughness and reflectivity dependent)

Field of View 320 x 240 µm
Pattern Recognition System CognexTM, Resolution 0.42 µm per pixel
Options
Advanced Laser-Leveling System

Automatic Alignment for Hands-Off Operation

Process Recording

Chip Solder flux or Epoxy Coating

Unit Formic Acid Vapor Bonding Environment

Nanoimprint Lithography Configuration

Gas Confining Enclosure for Mass Reflow

Chip Flipper (configuration dependent)

Dispensers:

Time/Pressure

Positive Displacement Pump

Jet

General Characteristics 
Machine Footprint 1500 x 980 mm
Machine Height 2170 mm
Machine Weight 800 kg
Electrical Power Supply 200 V / 220 V – 2 kVA, 50/60Hz, 1 phase

* Data, design and specifications depend on individual process conditions and can vary according to equipment configurations. Not all specifications may be valid simultaneously. Illustrations, photos and specifications in this datasheet are not legally binding. Specifications are subject to change without prior notice.

The FC150 accommodates a wide variety of materials, including extremely fragile materials such as GaAs and HgCdTe and processes:

  Die Bonding, Flip Chip Bonding

  Mass Reflow, In-Situ Reflow, Fluxless Eutectic Bonding

  Thermocompression, Ultrasonic and Adhesive Bonding

  Gold, Gold/Tin, Indium, UV or Thermal Cure Adhesive, Polymers…

  Fragile Material Compatibility: InP, GaAs, MCT…

Bond process changes are easily achieved.

  Chip-to-Chip, Chip-to-Substrate Bonding, Chip Stacking

  3D Integration

  Optoelectronic & Photonic Devices Assembly

  MOEMS, MEMSMCM

  Nanoimprint Lithography: Aligned UV-NIL and Hot Embossing on Wafer