ACCµRA OPTO

ACCµRA OPTO: Optoelectronics and Silicon Photonics,

High Accuracy Flip-Chip Bonder 0.5 μm

The ACCµRA OPTO is a flip-chip bonder that allows ± 0.5 μm accuracy. It is dedicated to low force and reflow processes. Motorized axes guarantee a high repeatability of your process.

The ACCμRA Opto combines high precision, flexibility and accessibility. It is the perfect equipment for optoelectronics and silicon photonics applications.

Highlights

  • Post-bonding accuracy* (± 0,5 μm)
  • Low Force Bonding
  • Confining Gas
  • Easy to use and very flexible
  • Quick set-up of new applications
  • Small footprint and compact design

*depending on configuration and application.

Open platform associated to an intuitive interface results in a quick set-up for new applications

Robust design and closed loop systems guarantee a high repeatability in operations

High precision, accurate control of low forces and user-friendly interface for multiple applications and processes.

Components Size
Chip (Upper Die) 0.2 ~ 50 mm (square)
Substrate (Lower Component) 0.2 ~ 100 mm (square)
Total Thickness 0,03 ~ 8 mm
Bonding Arm
Post-Bonding Accuracy* ± 0.5 μm
Z resolution 0.01 μm
Force 0.2 up to 10N
Alignment Stage
XY stage Resolution 0.015 μm
Theta Travel ± 5 degrees, Resolution 1 μradian
Bonding Heads
Room Temperature Square 22 mm
Heating Square 22, 400°C
UV 80 mW/cm² @ 365 nm
Substrate Chucks
Room Temperature Square 50 or 100mm
Heating Square 22, 50 or 100mm, 400°C
Optics
Digital camera resolution 2 sight cameras 0,37 µm/pixel
Field of View 900 x 700 µm
Automatic alignment Optional
Options
Dispenser Ionizers bar
UV Curing system Flux or Adhesive dipping station
Face up alignment and pick up station Frame with elastomer insulator
Process recording Automatic alignment
General Characteristics
Machine Footprint 955 x 1 110 mm
Machine Height 800mm
Machine Weight ~450 kg

*Data, design and specifications depend on individual process conditions and can vary according to equipment configurations. Not all specifications may be valid simultaneously. Illustrations, photos and specifications in this datasheet are not legally binding. Specifications are subject to change without prior notice.

Main bonding processes

Flip-chip bonding

Die bonding

Pick and place

Thermocompression

Reflow

UV curing

Gold, Gold/Tin, Indium, Copper

Main Applications

Laser diode, laser bar

VCSEL, photo diode

LED

Prisms, Lenses, Mirrors assembly

Micro assembly

Flip-chip bonding, die bonding

Chip-to-chip, chip-to-substrate bonding

Nanoimprinting (UV NIL and Hot Embossing)