Die Bonders

ACCµRA M Manual Flip Chip Bonder

The ACCμRA M is a manual flip-chip bonder that allows ± 5 μm accuracy. This equipment permits to align manually the components with a high level of precision. The motorized arm controls precisely the bonding force. Combining and synchronizing the arm with the temperature controller, it guarantees a perfect quality and high repeatability of your process. The ACCμRA M is more than a pick-and-place system. It offers thermocompression and reflow capabilities. It is the perfect equipment for universities and R&D institutes.

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ACCµRA OPTO: Optoelectronics and Silicon Photonics, High Accuracy Flip-Chip Bonder 0.5 μm

The ACCµRA OPTO is a flip-chip bonder that allows ± 0.5 μm accuracy. It is dedicated to low force and reflow processes. Motorized axes guarantee a high repeatability of your processes. The ACCμRA Opto combines high precision, flexibility and accessibility. It is the perfect equipment for optoelectronics and silicon photonics applications.

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ACCµRA100: High Accuracy Flip-Chip Bonder (Education and R&D oriented)

The ACCµRA™100 is a semi-automatic flip-chip bonder that guarantees ±0.5 µm placement accuracy. Its flexibility makes it ideal for developing a wide range of applications. ACCµRA™100 combines high precision, accessibility and cost-effectiveness. It is the perfect equipment for universities and R&D institutes.

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FC150 Automated Die / Flip Chip Bonder

With ± 0.5 µm placement accuracy and ± 1 µm post-bond accuracy, the SET FC150 Die/Flip Chip Bonder offers the latest evolutions in bonding techniques. With configurations ranging from manual to full automation, the FC150 provides development and production capabilities on a single upgradeable cost-effective platform. The high degree of flexibility offered on the FC150 makes it the machine of choice for advanced research with the ability to move directly into pilot production.

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fc300

FC300 High Precision Die / Flip Chip Bonder

The FC300 High Precision Die / Flip Chip Bonder is a high accuracy and high force system for chip-to-chip and chip-to-wafer bonding, on wafers up to 300 mm. The tool features automated handling of chips and substrates up to 100 mm from waffle packs. It features also Nanoimprinting Lithography (NIL) capabilities.

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LDP150 Large Device Bonding Press

The LDP150 is an Electrical Press especially designed for bonding large light or radiation detectors (50 ~ 150 mm). It uses compression process at room temperature (thermo-compression option available). A predefined gap can be achieved between two components previously pre-bonded using a high accuracy device bonder such as the SET FC150 or the SET FC300.

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