Conférences / Exhibitions

MiNaPAD 2018, Grenoble, France (May 16-17)

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“MiNaPAD 2018“ venue: WTC Grenoble — Look at the Complete Program Here * Wednesday May 16, at 17:15 (Session H: Other Process) – SETNA will be presenting Surface Preparation using a Downstream Atmospheric Plasma, application to device packaging * Thursday May 17, at 11:40 (Session K: Flip-Chip Process & Applications) – SET Corporation will be presenting Direct Bonding with a new flip-chip bonder for production...

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ECTC 2018, May 29 – June 1, San Diego – CA, USA

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The Electronic Components and Technology Conference (ECTC) is sponsored by the Components, Packaging and Manufacturing Technology (CPMT) Society of the IEEE. Venue: Sheraton San Diego Hotel & Marina, San Diego, CA, USA. Exhibition hours: Wednesday, May 30 >> 9:00 am – noon & 1:30 – 6:30 pm Thursday, May 31      >> 9:00 am – noon & 1:30 – 4:00 pm We shall be pleased to welcome you to the SET/SETNA Booth #6001 to discuss accurate Die/Flip Chip bonding and surface preparation for bonding and other...

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SEMICON West, July 10-12, 2018, Moscone Center, San Francisco CA, USA

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SEMICON-West – Meet us on booth #6358 (North Hall) Venue: Moscone Center, San Francisco, CA. Exhibition hours: 10:00am to 5:00pm on Tuesday, July 10. 10:00am to 5:00pm on Wednesday, July 11. 10:00am to 4:00pm on Thursday, July 12. SETNA distribute the SET Corporation Bonders in North America. An expert from France will be available to present the brand new ACCµRA Bonder Series, especially designed for R&D and pilot lines. He will be also pleased to share information about the progress of the Future Equipment for High Volume...

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IWLPC 2018, October 23-25, 2018, San Jose, CA, USA

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International Wafer-Level Packaging Conference and Tabletop Exhibition Venue: DoubleTree by Hilton, San Jose, California, USA. Exhibition hours: Tuesday 23 — 10:00am to 5:00pm (Reception: 5:30pm to 7:00pm). Wednesday 24 — 9:30am to 3:30pm.   We shall be pleased to welcome you to the SETNA/SET Booth #11 to discuss accurate Die/Flip Chip bonding and surface preparation for bonding and other applications.     High Accuracy Die / Flip Chip Bonding SETNA distributes the SET Corporation Bonders in North America. We shall...

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