IWLPC 2018, October 23-25, 2018, San Jose, CA, USA

IWLPC – International Wafer-Level Packaging Conference and Tabletop Exhibition Venue: DoubleTree by Hilton, San Jose, California, USA. Exhibition hours: Tuesday 23 — 10:00am to 5:00pm (Reception: 5:30pm to 7:00pm). Wednesday 24 — 9:30am to 3:30pm.   We shall be pleased to welcome you to the SETNA/SET Booth #11 to discuss accurate Die/Flip Chip bonding and surface preparation for bonding and other applications.    ...

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SEMICON Europe 2018, Nov. 13-16, Munich, Germany

  SEMICON-Europa – Meet us on Booth A4-354 Venue:Messe München, Munich, Germany. Exhibition hours: 9:00am to 6:00pm on Tuesday, November 13. 9:00am to 6:00pm on Wednesday, November 14. 9:00am to 6:00pm on Thursday, November 15. 9:00am to 4:00pm on Friday, November 16.     Surface Preparation with Ontos Atmospheric Plasma We shall be pleased to discuss the Advantages of our Clean Atmospheric Plasma (Ontos) for Surface...

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